Method and apparatus for manufacturing a semiconductor device

Details Method and apparatus for manufacturing a semiconductor device Method and apparatus for manufacturing a semiconductor device

1998-03-09

2000-02-29

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156154, 156584, 438759, B32B 3500

Patent

active

060304855

ABSTRACT:
An apparatus for manufacturing a semiconductor device includes a wafer grinding section which grinds a wafer fixed on an ultraviolet sensitive tape and a drying section which dries the wafer after the wafer is ground. The drying section includes an ultraviolet irradiation device irradiating the ultraviolet sensitive tape with ultraviolet rays.

REFERENCES:
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5476566 (1995-12-01), Cavasin
patent: 5480842 (1996-01-01), Clifton et al.
patent: 5840614 (1998-11-01), Sim et al.

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