Method of making circuitized substrate

Details Method of making circuitized substrate Method of making circuitized substrate

1995-06-27

1997-02-04

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

055997473

ABSTRACT:
A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.

REFERENCES:
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5397917 (1995-03-01), Ommen et al.

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