System for process data association using LaPlace Everett interp

Details System for process data association using LaPlace Everett interp System for process data association using LaPlace Everett interp

1997-12-05

2000-08-01

Wachsman, Hal

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

702 83, 702 84, 702181, 700109, 700121, G06F 1900

Patent

active

060980249

ABSTRACT:
A method of utilizing associated process data parameters in the manufacture of semiconductor wafers by converting tool-based data to lot based data in order to predict wafer electrical test results from measured in-line critical dimensions, lot based data and the converted tool-based data. The converted tool-based data is obtained by interpolating data between a measurement obtained from a tool at a first time and a measurement obtained from the tool at a second time. The data association is obtained using LaPlace-Everett interpolation. The converted tool-based data can also be obtained by extrapolating data from the historical measurements taken from the tool.

REFERENCES:
patent: 5787190 (1998-07-01), Peng et al.
patent: 5866437 (1999-02-01), Chen et al.
patent: 5940300 (1999-08-01), Ozaki

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