Methods for spin drying a workpiece

Drying and gas or vapor contact with solids – Process – By centrifugal force

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34325, F26B 508

Patent

active

060293691

ABSTRACT:
A spin dryer assembly for drying workpieces such as semiconductor wafers includes a workpiece platform for receiving a workpiece to be dried. A motor is coupled to and spins the platform to effect removal of water and particulates from the workpiece. Gripping fingers are pivotally mounted around the platform and securely grip the workpiece during drying. Spring loaded plungers maintain the gripping fingers in a secured position during drying. A cam ring is vertically movable into and out of contact with the gripping fingers to bias the gripping portions of the fingers outwardly to a release position after drying.

REFERENCES:
patent: 4651440 (1987-03-01), Karl
patent: 4700595 (1987-10-01), Soares
patent: 4989345 (1991-02-01), Gill, Jr.
patent: 5469634 (1995-11-01), Mezaki
patent: 5577331 (1996-11-01), Suzuki
patent: 5667535 (1997-09-01), Kasahara
patent: 5778554 (1998-07-01), Jones
patent: 5784797 (1998-07-01), Curtis et al.
patent: 5829156 (1998-11-01), Shibasaki et al.
patent: 5873177 (1999-02-01), Honda et al.
patent: 5884412 (1999-03-01), Tietz et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods for spin drying a workpiece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for spin drying a workpiece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for spin drying a workpiece will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-671967

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.