Solderless connector technique and apparatus

Details Solderless connector technique and apparatus Solderless connector technique and apparatus

1986-08-19

1988-01-05

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439496, 439632, H01R 909

Patent

active

047173459

ABSTRACT:
A solderless connector technique and apparatus is presented for establishing electrical contact between a flexible circuit and another circuit device utilizing relative motion therebetween to wipe away or remove any debris or other foreign matter present on the terminals which could adversely effect electrical contact. In a first embodiment of the present invention, relative motion between the respective circuit devices is provided by male and female housings having a camming device incorporated therein. This camming device will effectively wipe away any foreign matter or debris located on the respective terminal devices. In another embodiment of the present invention, mechanical springs are used to provide lateral motion to the circuit devices thereby wiping away any dirt, dust or debris. Preferably, a means for prewiping i.e., a cleaning pad, is provided to the present invention to facilitate removal of debris.

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