Process for producing an interconnect structure on a printed-wir

Details Process for producing an interconnect structure on a printed-wir Process for producing an interconnect structure on a printed-wir

1995-08-03

1998-10-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2281801, H05K 334

Patent

active

058159193

ABSTRACT:
To prevent solder bridges that will easily occur in soldering an element whose leads are narrow in spacing. In a solder resist, there is provided an excess-solder absorbing region in which solder resist is not provided, between an end of a solder pad and the distal end of a lead. When a great deal of solder paste is applied to the solder pad for soldering the lead, an excess of solder melted due to the heat of a heater, flows along the lead and into the excess-solder absorbing region toward the distal end of the lead. Since the excess of solder does not flow across the solder resist provided between the leads, no solder bridge is formed.

REFERENCES:
IBM Tech. Disclosure Bulletin vol. 27, No. 48 Sep. 1984, pp. 2609-2610 "Enhanced Printed Circuit Board Design".

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