Printed board for electrical circuits

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

1566591, 156902, 156904, 174 685, 427 96, 428601, 428901, B32B 300, B32B 700, C23F 102, B44C 122

Patent

active

044408234

ABSTRACT:
A process for producing printed boards for electrical circuits in the case of which copper-coated board material is printed with an etch resist or etch resistant lacquer is representative of printed wiring to be produced, and after the curing of the etch resist, the copper layer is etched away at positions where it is not resist-covered. The etch resist is electrically conducting.
In a further development of the invention non-conducting etch resist is used for making crossovers of the printed wiring of a multi-layer printed board.

REFERENCES:
patent: 3998677 (1976-12-01), Anderson et al.

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