Method of plating treatment

Details Method of plating treatment Method of plating treatment

1988-04-05

1989-10-03

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427282, 427304, 118505, B05D 512

Patent

active

048715859

ABSTRACT:
A method of plating treatment for forming a plated coating on the surface of a workpiece except on a region thereof comprises the steps of placing a masking member made of water swelling rubber in abutment against or in close proximity to the region of the workpiece where no plating is desired, immersing, in this state, the masking member in water to cause the water swelling rubber to undergo volumetric self-swelling, and immersing the workpiece in a plating solution with the swelled masking member pressed against the particular region of the workpiece.

REFERENCES:
patent: 3171756 (1965-03-01), Marshall
patent: 3625758 (1971-12-01), Stahl
patent: 4152477 (1979-05-01), Haruta
patent: 4449983 (1984-05-01), Cortese
patent: 4624847 (1986-11-01), Ayer
Osamu Kano and Atsuo Senda, "Method of Plating Treatment", English translation of Japanese Kokai Pat. No. Sho 60[1985]-162789.
Herman F. Mark et al, "Encyclopedia of Polymer Science and Technology", John Wiley & Sons, 1966, pp. 469-470.
Fred W. Billmeyer, Jr., "Textbook of Polymer Science", John Wiley & Sons, 1962, pp. 387, 393.

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