Solder joint inspection feature for surface mount connectors

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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Details

228103, 2281802, H01R 2372

Patent

active

047566965

ABSTRACT:
A solder joint inspection feature (86) for evaluating the solder joint (88) securing a contact solder tail (58) of a surface mount connector to a printed circuit board (2). A solder joint inspection feature (86) is incorporated in the solder tail (58) of contacts (40) in a surface mount electrical connector a predetermined distance from the end. When the solder tails (58) are soldered, such as to traces (4) on a printed circuit board (2), an acceptable solder fillet (88a) will cover the inspection feature and thus the inspection feature (86) will not be visible. If the distal end (61) of the solder tail (58) is not close enough to the trace or if the fillet is formed with insufficient solder, the solder joint (88b) is unacceptable as indicated by the visible solder joint inspection feature (86).

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IBM Bulletin, vol. 29, No. 4, p. 1612, 9-1986.
Electronics, 11-3-1981, Sized Solder Bumps Make Solid Joints, p. 46.
Cleveland Electrical/Electronics Conference Digest, Vanzetti, p. 103, 5-20-1980.

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