Optical component package

Details Optical component package Optical component package

1985-09-03

1988-07-12

LaRoche, Eugene R.

350 9616, G02B 514

Patent

active

047565900

ABSTRACT:
Disclosed is an optical package including at least one electro-optical component aligned with at least one optical fiber. The electro-optical component is mounted on a surface which is essentially parallel to, but not coplanar with, the longitudinal axis of the fiber and light is coupled between the fiber and component by bending the light path. Electrical connection to the component is provided by conductors mounted over the same surface, thus producing a compact package. The invention is used preferably with arrays of components and fibers to eliminate the need for a vertical fanout to contact the components.

REFERENCES:
patent: 4130343 (1978-12-01), Miller et al.
patent: 4165496 (1979-08-01), Di Domenico, Jr. et al.
patent: 4647152 (1987-03-01), Jeskey
patent: 4650280 (1987-03-01), Sedlmayr
C. M. Miller, "Fiber-Optic Array Splicing with Etched Silicon Chips," The Bell System Technical Journal, vol. 57, No. 1, Jan. 1978, pp. 75-90.
M. G. Brown et al, "Fully Optical and Electrically Interfaced, Monolithic 1.times.12 Array of In.sub.0.53 Ga.sub.0.47 As/InP p-i-n Photodiodes," Proceedings of International Electron Devices Meeting, 1984, pp. 727-728.
P. P. Deimel et al, "Electrical and Optical Integration of a Monolithic 1.times.12 array of InGaAsP/Inp (.lambda.=1.3-.mu.m) Light-Emitting Diodes," Conference on Optical Fiber Communications Technical Digest, San Diego, Calif., Feb. 11-14, 1985, p. 32.

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