Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1998-08-07
2000-08-01
Gupta, Yogendra
Compositions
Electrically conductive or emissive compositions
Free metal containing
252500, 2525181, 252511, 428195, 428208, 420557, 420560, 264669, H01B 102
Patent
active
060962453
ABSTRACT:
Provided are a conductive resin composition having little negative impact on the environment, a resin molding which includes conductive parts of the conductive resin composition and insulating parts, and their methods of production. The production costs for the resin molding are low. The conductive resin composition is formed by kneading a thermoplastic or thermosetting resin with a low melting point alloy, wherein the low melting point alloy is moldable with the resin and consists essentially of tin and is free of lead. An insulating body is formed through primary molding of a thermoplastic or thermosetting resin, and is integrated with conductive parts of the conductive resin composition through secondary molding; or alternatively, conductive parts are formed through primary molding of the conductive resin composition and an insulating body is formed while being integrated with the conductive parts through secondary molding.
REFERENCES:
patent: 4545926 (1985-10-01), Fouts, Jr. et al.
patent: 4853155 (1989-08-01), Kurasawa
patent: 5084211 (1992-01-01), Kawakita et al.
patent: 5652042 (1997-07-01), Kawakita et al.
patent: 5830389 (1998-11-01), Capote et al.
patent: 5866044 (1999-02-01), Saraf et al.
Izawa Shogo
Kohama Tadahiko
Matsumoto Akikazu
Tanigaki Tsuyoshi
Aisin Seiki Kabushiki Kaisha
Gupta Yogendra
Hamlin D G
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