Gold paste for a ceramic circuit board

Details Gold paste for a ceramic circuit board Gold paste for a ceramic circuit board

1995-02-10

1998-02-03

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428325, 428344, 174261, 174256, B32B 300, B32B 1800, B32B 712, H01R 909

Patent

active

057142416

ABSTRACT:
An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.

REFERENCES:
patent: 2525209 (1950-10-01), Thomson
patent: 3021233 (1962-02-01), Fenity
patent: 3440182 (1969-04-01), Hoffman
patent: 3480566 (1969-11-01), Hoffman
patent: 3516949 (1970-06-01), Hoffman
patent: 3960777 (1976-06-01), Coyle
patent: 3969570 (1976-07-01), Smith
patent: 4004057 (1977-01-01), Hoffman et al.
patent: 5066620 (1991-11-01), Sunahara et al.

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