Method of planarizing by polishing a structure which is formed t

Details Method of planarizing by polishing a structure which is formed t Method of planarizing by polishing a structure which is formed t

1997-12-29

2000-08-01

Zimmerman, John J.

Etching a substrate: processes

Planarizing a nonplanar surface

451 28, H01L 21302

Patent

active

060962305

ABSTRACT:
A method of planarizing comprising providing a substrate having an uneven surface topography, forming a layer on the substrate, wherein the layer has a graded resistance to polishing, and polishing the layer.

REFERENCES:
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5449314 (1995-09-01), Meickle et al.
patent: 5674784 (1997-10-01), Jang et al.
patent: 5795495 (1998-08-01), Meikle

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