Conductive adhesive and circuit using the same

Details Conductive adhesive and circuit using the same Conductive adhesive and circuit using the same

1996-11-27

1998-02-03

Teskin, Fred

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428206, 428328, 428414, 428416, 428901, 523200, 523210, 523427, 523442, 525474, 525481, 525489, 25251914, 25251921, 25251933, 25251934, 2525212, 2525215, 156330, B32B 3300, H01B 106

Patent

active

057142386

ABSTRACT:
There is disclosed a conductive adhesive comprising
(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;
(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and
(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

REFERENCES:
patent: 1427786 (1922-09-01), Deaton
patent: 1911397 (1933-05-01), Saurbrey
patent: 2329993 (1943-06-01), Kriner
patent: 2560853 (1951-04-01), Eickmeyer et al.
patent: 2671554 (1954-11-01), Melroe
patent: 2742670 (1956-09-01), Morin
patent: 2771929 (1956-01-01), Alterio et al.
patent: 3359145 (1967-12-01), Salyer et al.
patent: 5166229 (1992-11-01), Nakano et al.

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