Substrate forming mold, and plate thickness adjusting method of

Details Substrate forming mold, and plate thickness adjusting method of Substrate forming mold, and plate thickness adjusting method of

1998-05-29

2000-08-01

Mackey, James P.

Plastic article or earthenware shaping or treating: apparatus

With apparatus assembly or dismantling means or with idle part

For extrusion or injection type shaping means

425195, 425810, 29428, 264 39, B29C 4526

Patent

active

060957867

ABSTRACT:
A substrate forming mold for forming a substrate by filling a cavity formed between a pair of matching molds 1, 2 with resin, that is, this substrate forming mold has shims 9, 12 disposed at least between a mirror finished surface plate 6 for composing one mold 1 and a stable mold base 8, and in a region inside of a fixed abutting ring 13, depending on fluctuations of plate thickness of formed substrate. As a result, the plate thickness of formed substrate can be adjusted finely, and fluctuations occurring in the radial direction or peripheral direction of the formed substrate can be decreased.

REFERENCES:
patent: 4374636 (1983-02-01), Holmes
patent: 4681527 (1987-07-01), Amory et al.
patent: 4715804 (1987-12-01), Takahashi
patent: 4737096 (1988-04-01), Poorten
patent: 5792492 (1998-08-01), Takahashi

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