Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1975-04-11
1976-10-05
Trohe, J. V.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
174 52FP, H05K 500
Patent
active
039847390
ABSTRACT:
An integrated circuit package structure wherein electrodes of an integrated circiut chip are directly bonded to metal lead members within the package. A portion of the substrate is enclosed inside the package to support the package. Holes are provided on the substrate for positioning and securing the package to the substrate. The substrate has a generally rectangular opening disposed therethrough arranged and configured to receive an integrated circuit chip and at least two additional openings disposed in said substrate so as to form at least two support arms adjacent to the rectangular opening. The integrated circuit package has a top member, a bottom member and a circuit chip. The circuit chip has a plurality of electrodes disposed thereon in a predetermined configuration for selectively coupling the lead members which are disposed on the substrate. By the use of the integrated circuit package structure of the present invention, circuit packages may be securely and easily coupled to a substrate and held in position.
REFERENCES:
patent: 3684818 (1972-08-01), Netherwood
patent: 3763404 (1973-10-01), Aird
patent: 3793714 (1974-02-01), Bylander
patent: 3868725 (1975-02-01), Degraaff
patent: 3909838 (1975-09-01), Beyerlein
Kimura Satoshi
Komiyama Katsuhiko
Mochizuki Yoshifumi
Citizen Watch Co. Ltd.
Tone D. A.
Trohe J. V.
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