Processing and post-processing compositions and methods of using

Details Processing and post-processing compositions and methods of using Processing and post-processing compositions and methods of using

1996-01-17

2000-08-01

Powell, William

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 2, 252 791, 252 794, C25F 330

Patent

active

060951613

ABSTRACT:
A composition for use in processing and cleaning substrates includes a compound of the formula (I): R.sup.1 --C(O)--NR.sup.2 --[(CR.sup.3 R.sup.4).sub.x --N--R.sup.5 ].sub.y --[C(O)].sub.z --R.sup.6, wherein each of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 is independently H or an organic group, x=1-10, y=0-10, and z=0-1. The compound of Formula I is preparable by a condensation reaction of a carboxylic acid and an amine. A method of processing a substrate includes, for example, planarizing the substrate surface with a processing composition comprising a compound of Formula I. A method of cleaning a substrate and processing equipment after, for example, planarizing a substrate surface with an abrasive material includes cleaning the substrate surface and processing equipment with the cleaning composition.

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H. Akiya et al., "Thin-Oxide Dielectric Strength Improvement by Adding a Phosphonic Acid Chelating Agent into NH.sub.4 OH--H.sub.2 O.sub.2 Solution", J. Electrochem. Soc., 141, 4 pgs. (1994).
P. Hidber et al., "Citric--A Dispersant for Aqueous Alumina Suspensions", J. Am. Ceram. Soc., 79, 1857-1867 (1996).

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