Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

1974-03-27

1976-10-05

Tillman, Murray

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 458N, 260 47EC, 260 59EP, 260 78UA, 260 78SC, 260830P, 260DIG24, 428417, C08G 3014

Patent

active

039843734

ABSTRACT:
An epoxy resin composition containing an N,N'-unsaturated amic acid compound represented by the general formula, HOCO--R.sub.2 --CONH--R.sub.1 --Y, wherein R.sub.1 is a divalent group having 2 or more carbon atoms, R.sub.2 is a divalent group having a carbon-to-carbon double bond, and Y is ##EQU1## or --NHCO--R.sub.2 --COOH. The composition is characterized, by being favorable in curing characteristics, heat resistance, and flame retardance.

REFERENCES:
patent: 3627730 (1971-12-01), Moran, Jr.
patent: 3730948 (1973-05-01), Akiyama
patent: 3839358 (1974-10-01), Bargain

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