Semiconductor device package having lead frame structure with in

Details Semiconductor device package having lead frame structure with in Semiconductor device package having lead frame structure with in

1975-05-07

1976-10-05

Lake, Roy

Geometrical instruments

174 16HS, 174 52FP, H05K 112, H05K 506

Patent

active

039841669

ABSTRACT:
A semiconductor device package which can be readily mounted on a printed circuit board without requiring soldering or intermediate connectors. A supporting substrate has a unique lead frame configuration thereon in which the leads extend around side portions of the substrate and form integral spring contacts projecting from the lower surface of the substrate. The package preferably includes a metallic stud having a head portion mounted in the substrate for receiving a semiconductor device and a rod portion extending from the lower surface of the substrate. The rod portion of the stud can be removably secured in an aperture in a printed circuit board to engage the spring contacts with corresponding conductors on the circuit board.

REFERENCES:
patent: 3311790 (1967-03-01), Vizzier et al.
patent: 3340347 (1967-09-01), Spiegler
patent: 3634600 (1972-01-01), Griffin et al.
patent: 3678385 (1972-07-01), Bruner
patent: 3735214 (1973-05-01), Renskers et al.
patent: 3930115 (1975-12-01), Uden et al.
Arnold et al.; Integrated Circuit Component; IBM Tech. Disclosure Bulletin vol. 12, No. 6, Nov. 1969; p. 793.

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