Nitrogen and sulfur compositions and acid copper plating baths

Details Nitrogen and sulfur compositions and acid copper plating baths Nitrogen and sulfur compositions and acid copper plating baths

1977-12-21

1979-01-16

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204DIG2, 252182, 260453RW, 260455A, C07C15300, C07C15500, C25D 338

Patent

active

041348036

ABSTRACT:
Nitrogen and sulfur compositions are described which are useful in aqueous acidic plating baths and processes for electrodepositing bright and level copper coatings. The compositions are prepared by reacting a mixture of

REFERENCES:
patent: 2849351 (1958-08-01), Gundel et al.
patent: 3023215 (1962-02-01), Gundel
patent: 3101305 (1963-08-01), Roth et al.
patent: 3122549 (1964-02-01), Gundel
patent: 3359297 (1967-12-01), Gundel
patent: 3414493 (1968-12-01), Nobel et al.
patent: 3725220 (1973-04-01), Kessler et al.
patent: 3784454 (1974-01-01), Lyde
patent: 3798138 (1974-03-01), Ostrow et al.
patent: 4038161 (1977-07-01), Eckles et al.

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