Method and apparatus for adhesion of semiconductor substrate

Details Method and apparatus for adhesion of semiconductor substrate Method and apparatus for adhesion of semiconductor substrate

1998-03-19

1999-10-12

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156580, B32B 3100

Patent

active

059649780

ABSTRACT:
A method and apparatus for adhesion of a semiconductor substrate on a support block in a condition that there are no minute concave or convex portions on the semiconductor substrate are proposed and have features that not only is the semiconductor substrate supported at its periphery in a squeezing condition but a back pressure is also applied on the semiconductor substrate with an air bag in such a manner that a region of the air bag corresponding to the central region of the semiconductor substrate is most swelled out, so that the semiconductor substrate is curved and the central region of the semiconductor substrate is pressed to the support block and thereafter, the squeezing condition of the semiconductor substrate is released to make the semiconductor substrate adhered to the support block.

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