Post-etching alkaline treatment process

Details Post-etching alkaline treatment process Post-etching alkaline treatment process

1998-05-26

1999-10-12

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 13, 134 33, 438691, 438692, 438959, C30C 2300, B08B 600, B08B 700

Patent

active

059649534

ABSTRACT:
The present invention is directed to a process for removing aluminum contamination from the surface of an etched semiconductor wafer. The process is carried out by first lapping a semiconductor wafer in a lapping slurry containing aluminum, etching the wafer, and finally immersing the wafer in an aqueous bath, the bath comprising an alkaline component and a surfactant.

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