Printed circuit board with heat dissipating device

Details Printed circuit board with heat dissipating device Printed circuit board with heat dissipating device

1989-04-18

1991-04-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 174252, 357 81, 361414, H05K 720

Patent

active

050123874

ABSTRACT:
To provide heat dissipation from components mounted on a printed circuit board, a copper layer is applied to a printed circuit board. A layer of pure aluminum is applied to this copper layer by electroplating. The printed circuit board is coated on both sides with copper and pure aluminum layers. The components are mounted on one of the copper and pure aluminum layers. The printed circuit board has bores in the regions of the components. The copper and pure aluminum layers extend over the inner walls of these bores, whereby communication is established between the copper and pure aluminum layer in contact with the components and the copper and aluminum layer on the opposite side of the printed circuit board. The pure aluminum layer applied by electroplating is mechanically machined in the region of the components to achieve a planar surface. Areas are left open in the copper and pure aluminum layer. Soldering contacts and strip conductors are arranged provided on the printed circuit board within these left-open areas.

REFERENCES:
patent: 3781596 (1973-12-01), Galli
patent: 4368503 (1983-01-01), Kurosawa
patent: 4639835 (1987-01-01), Daubresse
patent: 4677252 (1987-06-01), Takahashi
patent: 4714952 (1987-12-01), Takekawa
patent: 4764847 (1988-08-01), Eisenblatter
patent: 4810563 (1989-03-01), De Gree
patent: 4827377 (1989-05-01), Butt
patent: 4854038 (1989-08-01), Wiley

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