Contact assembly for small semiconductor device

Details Contact assembly for small semiconductor device Contact assembly for small semiconductor device

1985-01-07

1986-10-07

Edlow, Martin H.

357 68, H01L 2348

Patent

active

046162500

ABSTRACT:
A resilient contact assembly for contacting a semiconductor device comprises a center segment and first and second side segments. The center segment has an open-ended pocket in the end thereof for receiving, positioning and supporting the semiconductor device. The ends of the side segment are bent out of the plane of the center segment and first and second contact arms extend therefrom towards said pocket to contact the semiconductor device.

REFERENCES:
patent: 3500136 (1970-03-01), Fischer
patent: 3569797 (1971-03-01), Simmons
patent: 3577633 (1971-05-01), Homma
patent: 4346396 (1982-08-01), Carroll, II et al.

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