Mold flow regulating dam ring

Details Mold flow regulating dam ring Mold flow regulating dam ring

1998-02-23

1999-10-12

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

26427217, 26432812, H01R 4300

Patent

active

059640308

ABSTRACT:
An apparatus and method for balancing the flow of molten molding compound above and below an integrated circuit assembly during encapsulation of the assembly. An annular shaped layer of material is placed over the bonding fingers of a leadframe such that the annular shaped layer of material peripherally surrounds the centrally located opening in the leadframe. The annular shaped layer of material has sufficient width and thickness to slow the flow of molten molding material over the top surface of the integrated circuit assembly to the same speed as the flow of molten material under the bottom surface of the integrated circuit package assembly. In so doing, the present invention reduces the formation of blowholes or voids in encapsulated integrated circuit packages.

REFERENCES:
patent: 5096853 (1992-03-01), Yasunaga et al.
patent: 5197183 (1993-03-01), Chia et al.
patent: 5406699 (1995-04-01), Oyama
patent: 5577319 (1996-11-01), Knecht
patent: 5692296 (1997-12-01), Variot
patent: 5724726 (1998-03-01), Tomita et al.
Research Disclosure Dec. 1992, No. 34439 Moldless IC Package.

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