Copper-foiled laminate for base plate

Details Copper-foiled laminate for base plate Copper-foiled laminate for base plate

1985-02-14

1986-10-07

Herbert, Thomas J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

427 96, 428336, 428469, 428698, 428701, 428901, B32B 1504, B32B 1520

Patent

active

046159452

ABSTRACT:
A copper-foiled laminate suitable as a base plate of printed circuit boards and the like electronic parts. The laminate is composed of an aluminum plate as the base, a layer of aluminum oxide formed on the aluminum plate, a layer of an amorphous silicon carbide formed on the aluminum oxide layer and a copper foil adhesively bonded to the surface of the silicon carbide layer so that the laminate has a high thermal conductivity providing a heat dissipative surface essential in high-performance electronic parts.

REFERENCES:
patent: 4293617 (1981-10-01), Nagy
patent: 4431707 (1984-02-01), Burns et al.
patent: 4482209 (1984-11-01), Grewal et al.

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