Substrateless decorative emblem and method of making

Details Substrateless decorative emblem and method of making Substrateless decorative emblem and method of making

1985-06-12

1986-10-07

Epstein, Henry F.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156247, 156249, 264130, 264131, 264132, B60R 1304

Patent

active

046157549

ABSTRACT:
A decorative emblem and method of manufacture are provided. The emblem includes a plastic cap overlying a printed and/or decorated upper surface of an adhesive layer. The need for an intermediate metal, plastic, or paper substrate is eliminated. By treating the upper surface of the adhesive to render it tack free, the printing and/or decoration may be applied to that surface and the cap formed directly thereon.

REFERENCES:
patent: 1693561 (1928-11-01), Klein
patent: 2021961 (1935-11-01), MacFarlane
patent: 2354857 (1944-08-01), Gits et al.
patent: 2376305 (1945-05-01), Bauer
patent: 3235396 (1966-02-01), Haberlin
patent: 3964906 (1976-06-01), Kenney
patent: 3974311 (1976-08-01), Cherrin
patent: 4100010 (1978-07-01), Waugh
patent: 4135033 (1979-01-01), Lawton
patent: 4210693 (1980-07-01), Regan et al.
patent: 4259388 (1981-03-01), Reed
patent: 4331704 (1982-05-01), Watson, Jr. et al.
patent: 4332074 (1982-06-01), Auld et al.
patent: 4351686 (1982-09-01), Clark
patent: 4356617 (1982-11-01), Coscia
patent: 4409264 (1983-10-01), Gilleo et al.
patent: 4446179 (1984-05-01), Waugh
patent: 4460429 (1984-07-01), Coscia et al.
patent: 4481160 (1984-11-01), Bree

Affiliated with

Also associated with

Rating

Substrateless decorative emblem and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrateless decorative emblem and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrateless decorative emblem and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-641544