Metallizing composition for use with ceramics

Details Metallizing composition for use with ceramics Metallizing composition for use with ceramics

1988-12-23

1991-04-30

Barr, Josephine

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 115, 106 126, 106 128, 252512, 252514, 252518, B05B 700, H01B 102, H01B 106

Patent

active

050115308

ABSTRACT:
Metallizing composition for use in ceramics, comprises 100 parts by weight of a CuO-Cu combination consisting of 30-70 wt % CuO and 70-30 wt % Cu, at least one inorganic component selected from not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder and a solvent, wherein the Cu particles have a size in the range of 0.5-20 .mu.m and consist of at least two classes of particles having different average sizes.

REFERENCES:
patent: 4172919 (1979-10-01), Mitchell
patent: 4552691 (1985-11-01), Shoji et al.
patent: 4623482 (1986-11-01), Kuo
patent: 4687597 (1987-08-01), Siuta
patent: 4695403 (1987-09-01), Nishimura et al.

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