Semiconductor device with a carrier body on which a substrate wi

Details Semiconductor device with a carrier body on which a substrate wi Semiconductor device with a carrier body on which a substrate wi

1997-07-08

1998-04-14

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257781, 257 75, 257779, H01L 2348

Patent

active

057395918

ABSTRACT:
A semiconductor device with a carrier body on which a substrate is fastened by means of a glue layer, which substrate is provided at its first side facing the carrier body with a semiconductor element and with a pattern of conductor tracks comprising contact electrodes for external contacting from the second side of the substrate facing away from the carrier body. The substrate is provided with windows at the areas of the contact electrodes for external contacting from the second side. The process steps preceding the gluing of the substrate to the carrier body are carried out in a clean room suitable for the manufacture of semiconductor elements, whereas the remaining process steps are preferably carried out in a final mounting room. Expensive lithographical equipment need not be available in both rooms, because the comparatively large windows can be formed by means of a simple contact mask.

REFERENCES:
patent: 4980308 (1990-12-01), Hayashi et al.
patent: 5213990 (1993-05-01), Rodder
patent: 5254868 (1993-10-01), Saito
patent: 5286670 (1994-02-01), Kang et al.
patent: 5349228 (1994-09-01), Neudeck et al.

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