Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-07-29
1998-04-14
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257737, 257738, 257693, 257680, 257774, 257778, 257787, H01L 2302, H05K 334
Patent
active
057395853
ABSTRACT:
A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are formed through the interconnect opening to establish electrical communication between the bond pads on the die and the conductors on the package body. The conductors on the package body can include solder bumps to permit the package to be flip chip mounted to a supporting substrate such as a printed circuit board or to be mounted in a chip-on-board configuration. The package can be fabricated by bulk micro-machining silicon wafers to form the package bodies, attaching the dice to the package bodies, and then singulating the wafer. Alternately the package body can be formed of a FR-4 material. In addition, multiple dice can be attached to a package body to form a multi-chip module.
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Akram Salman
Farnworth Warren M.
Wood Alan G.
Gratton Stephen A.
Micro)n Technology, Inc.
Thomas Tom
Williams Alexander Oscar
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