Fishing – trapping – and vermin destroying
Patent
1994-01-18
1995-05-16
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437 9, 437209, 437248, 437902, 257796, 257675, H01L 2160
Patent
active
054160464
ABSTRACT:
A method for manufacturing semiconductor heat-cooling devices. A semiconductor heat-cooling device has a plurality of semiconductor chips, an upper ceramic layer and a lower ceramic layer. By means of a supporting mesh between the upper layer and the lower layer, the semiconductor chips can be fixed and soldered to the conductive films on the inner surfaces of the two ceramic layers. The method not only increases the manufacturing yield rate and production throughput but also prevents moisture generated during the cooling process from entering the space between the ceramic layers. Short circuiting of semiconductor chips can also be avoided and the efficiency of the device can be maintained. By adding a sealing body to the edges of the supporting mesh, the space between the two ceramic layers is sealed. Erosion of and damage to the semiconductor chips is thus effectively minimized and the service life of the device is prolonged.
REFERENCES:
patent: 4600936 (1986-07-01), Khoury et al.
patent: 4709468 (1987-12-01), Wilson
patent: 5158912 (1992-10-01), Kellerman et al.
Chaudhuri Olik
Pham Long
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