Mechanically captivated integrated circuit chip

Details Mechanically captivated integrated circuit chip Mechanically captivated integrated circuit chip

1995-09-25

1997-07-29

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361783, 361807, 333247, 257728, 437209, H05K 702, H01L 2158

Patent

active

056526962

ABSTRACT:
A high frequency microwave integrated circuit assembly (14,20) includes a fragile monolithic microwave integrated circuit (MMIC) chip (22) mounted in an MMIC subassembly (20) that is completely assembled, tested and burned in independent of the main high frequency microwave integrated circuit assembly and is mechanically attached to the main assembly by a captivation screw (100). The MMIC chip (22) is bonded to an uppermost tier (30) of a multi-tier spaced pedestal (26) and is received within an aperture (46) within a slave board (44) that itself is mounted and bonded to a lower tier (28) of the pedestal (26). The main integrated circuit assembly is formed with a rectangular opening (84) in an upper portion of its substrate to non-rotationally receive the rectangular slave board and a slightly larger internally threaded circular hole (94) in a lower portion of the main assembly substrate that threadedly receive the captivation screw (100). The configuration is such that the subassembly of pedestal, slave board and MMIC are interposed between the captivation screw and the main assembly substrate and physically captured by pressure of the screw which urges the subassembly of pedestal, slave board and chip against the lower side of the main assembly substrate.

REFERENCES:
patent: 3343107 (1967-09-01), Golightly
patent: 3769560 (1973-10-01), Miyake et al.
patent: 4164003 (1979-08-01), Cutchaw
patent: 4232277 (1980-11-01), Dickens et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4576224 (1986-03-01), Eaton et al.
patent: 4835495 (1989-05-01), Simonutti
patent: 5300175 (1994-04-01), Gardner et al.
Package Technique, G.B. Cherniack, M.D. Silver, E.M. Suden, IBM Technical Disclosure Bulletin, vol. 9 No. 11 Apr. 1967.

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