Semiconductor encapsulating epoxy resin compositions and semicon

Details Semiconductor encapsulating epoxy resin compositions and semicon Semiconductor encapsulating epoxy resin compositions and semicon

1996-03-14

1998-04-14

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 89, 528 99, 525523, 525538, 523400, 523401, C08G 5968, C08G 6510

Patent

active

057391874

ABSTRACT:
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

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