Semiconductor device encapsulating a multi-chip array

Details Semiconductor device encapsulating a multi-chip array Semiconductor device encapsulating a multi-chip array

1982-06-15

1986-03-25

Edlow, Martin H.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 80, 361417, 361419, 361420, 361421, H01L 2316

Patent

active

045786976

ABSTRACT:
A semiconductor device having a chip-array construction comprising a plurality of semiconductor chips (1-1.about.1-4) and a package (4) on which the semiconductor chips are mounted. On the package, common conductive strips (9-1.about.9-6) which are commonly used for all the chips and arranged between the package and the chips and individual conductive strips (10-1.about.10-4) which are used peculiar to each of the chips, are provided. Such common conductive strips and individual conductive strips are formed by a single conductive layer.

REFERENCES:
patent: 3312771 (1967-04-01), Hessinger et al.
patent: 3483038 (1969-12-01), Hui et al.
patent: 3568012 (1971-03-01), Ernst
patent: 3611317 (1971-10-01), Bonfeld
patent: 3641401 (1972-02-01), Lynch
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3903590 (1975-09-01), Yokogawa
patent: 4038488 (1977-07-01), Lin
patent: 4297719 (1981-10-01), Hsu

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