Soldering flux composition and solder paste composition

Details Soldering flux composition and solder paste composition Soldering flux composition and solder paste composition

1993-01-07

1994-08-02

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

053342615

ABSTRACT:
Soldering flux and solder paste compositions which are non-acidic, low-residue, and non-corrosive, leaving no substantial residue after soldering without a subsequent cleaning process and yet exhibiting excellent solderability are disclosed. The compositions comprise (A) at least one compound which generates a peroxide by decomposition or oxidation when subjected to heating, and (B) at least one ester from an inorganic or organic acid which generates an acid by decomposition in the presence of compound (A). They are particularly advantageous for eliminating the cleaning process with a solvent such as Flon to solve the ozone layer destruction problem and for improving the performance of the in-circuit test for printed-circuit boards after soldering.

REFERENCES:
patent: 2169659 (1939-08-01), Noble
patent: 2829998 (1958-04-01), Sutton
patent: 4092182 (1978-05-01), Arbib
patent: 4180419 (1979-12-01), Thompson
patent: 4243440 (1981-01-01), Arbib
patent: 4601763 (1986-07-01), Stratil et al.

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