Pressureless sintering process to produce high thermal conductiv

Details Pressureless sintering process to produce high thermal conductiv Pressureless sintering process to produce high thermal conductiv

1985-04-29

1986-03-25

McCarthy, Helen M.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 61, 264 63, 264 66, 501 96, 501 98, 501152, C04B 3558, F27D 706

Patent

active

045782334

ABSTRACT:
A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon FJDSR but not including line RF of FIG. 4, a porosity of less than about 10% by volume, and a thermal conductivity greater than 1.00 W/cm.multidot.K at 25.degree. C. which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges from point D up to point F of FIG. 4, said compact having an equivalent % composition of Y, Al, O and N outside the composition defined and encompassed by polygon FJDSR and FIG. 4, heating said compact up to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon FJDSR but not including line RF of FIG. 4, and sintering said deoxidized compact at a temperature of at least about 1840.degree. C. producing said ceramic body.

REFERENCES:
patent: 3833389 (1974-09-01), Komeya et al.
patent: 3930875 (1976-01-01), Ochiai et al.
patent: 4097293 (1978-06-01), Komeya et al.
patent: 4203733 (1980-05-01), Tanaka et al.
patent: 4435513 (1984-03-01), Komeya et al.
patent: 4478785 (1984-10-01), Huseby et al.
patent: 4519966 (1985-05-01), Aldinger et al.
patent: 4533645 (1985-08-01), Huseby et al.
patent: 4540673 (1985-09-01), Takeda et al.
patent: 4547471 (1985-10-01), Huseby et al.
Werdecker, W. et al.--"Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Micro Circuits"--pp. 402-406 IEEE, May 1984.
K. Shinozaki, et al., "Sintering Behavior and Thermal Characteristics of Pressureless Sintered AlN with Y.sub.2 O.sub.3 Addition," 22nd Symposium on Basic Science of Ceramics, Yogyo-Kyokai, Jan. 1984, p. 43.
Bulletin of American Ceramic Society, vol. 63, No. 8 (1984), p. 1009.
Heraeus PS-B-80, 4 pages.
Komeya, et al. "Effects of Various Additives on Sintering of Aluminum Nitride", Yogyo-Kyokai-shi, 89, 6, (pp. 58-64), 1981.
"Science of Ceramics", vol. 6, 1973, pp. XX/3-XX13.
Komeya et al., Trans. & J. Brit. Ceram. Soc., 70 (3), pp. 107-113 (1971) "The Influence of Fibrous Aluminum Nitride on the Strength of Sintered AlN-Y.sub.2 O.sub.3.
Advanced Optical Ceramics, Phase III, Final Report, DIN:82SDR2006, Feb. 1982, pp. 4-68 to 4-80 and pp. 4-127 to 4-137, esp. pp. 4-128 and 4-129.
Slack, G. A. "Nonmetallic Crystals with High Thermal Conductivity", J. Phys. Chem. Solids, 1973, vol. 34, pp. 321-335.
Litvimenko, V. F. et al. "Thermophysical Properties of Aluminum Nitride-Yttria Materials", translated from Poroshkovaya Metallurgiya, No. 6(246), pp. 77-79, Jun., 1983, pp. 490-492.
Schwetz, K. A. et al. "Sintering of Aluminum Nitride with Low Oxide Addition", Progress in Nitrogen Ceramics (1983) pp. 245-252.
Iwase, N. et al. "Development of a High Thermal Conductive AlN Ceramic Substrate Technology", the International Journal for Hybrid Microelectronics, vol. 7, #4, Dec. 1984.

Affiliated with

Also associated with

Rating

Pressureless sintering process to produce high thermal conductiv does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressureless sintering process to produce high thermal conductiv, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressureless sintering process to produce high thermal conductiv will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-629703