Semiconductor integrated circuit device

Details Semiconductor integrated circuit device Semiconductor integrated circuit device

1989-03-24

1989-10-31

Hille, Rolf

357 80, 357 71, H01L 2348, H01L 2314

Patent

active

048780987

ABSTRACT:
A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.

REFERENCES:
patent: 3623961 (1971-11-01), Laer
patent: 4472730 (1984-09-01), Ohta
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4543715 (1985-10-01), Iaarola et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4706167 (1987-11-01), Sullivan
"A New LSI Interconnection Method for IC Card", Ohuchi et al., 1986 IEMT Symposium, USA.

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