Method for mounting a semiconductor device on a circuit board

Details Method for mounting a semiconductor device on a circuit board Method for mounting a semiconductor device on a circuit board

1996-10-15

1997-07-29

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29846, H05K 330

Patent

active

056511795

ABSTRACT:
A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4157932 (1979-06-01), Hirata
patent: 4814040 (1989-03-01), Ozawa
patent: 4917466 (1990-04-01), Nakamura et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5318651 (1994-06-01), Matsui et al.
patent: 5384952 (1995-01-01), Matsui
patent: 5412867 (1995-05-01), Aikawa et al.
European Search Report dated Feb. 27, 1995.

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