Hot-melt adhesive that has good open time at room temperature an

Details Hot-melt adhesive that has good open time at room temperature an Hot-melt adhesive that has good open time at room temperature an

1994-01-14

1996-04-30

Seidleck, James J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156327, 428335, 428355, 524272, 524274, C09J 500, C09J12308

Patent

active

055121241

ABSTRACT:
A hot-melt adhesive of ethylene/vinyl acetate copolymer and tackifying resin can be spread into a thin layer that remains tacky for more than 5 seconds, after which a bond can be made without applying heat or more than hand pressure. Within a short period of time, the adhesive crystallizes so that the bond becomes creep-resistant. The temperature at which this hot-melt adhesive can be spread into thin layers is significantly lower than could be used with prior hot-melt adhesives that develop creep resistance.

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