Single-In-Line plastic package with open ended slots for sliding

Details Single-In-Line plastic package with open ended slots for sliding Single-In-Line plastic package with open ended slots for sliding

1990-07-06

1991-07-09

Hille, Rolf

357 81, 357 68, H01L 2336, H01L 2340, H01L 2312

Patent

active

050310232

ABSTRACT:
A Single-In-Line molded resin package for a medium-power semiconductor device destined to receive an external heat sink mounted thereon is provided with one or more parallel open ended slots, perpendicular to the coupling face with the heat sink and open on the side of the package opposite to the side from which the pins projects.
The stems of the fastening screws which may be conveniently pre-arranged on the coupling face of the heat sink are slidingly received in the respective open ended slots or notches of the various devices aligned on the printed circuit card thus simplifying the assembly operations and making them more compatible to automation.

REFERENCES:
patent: 3864727 (1975-02-01), Schoberl
patent: 4095253 (1978-06-01), Yoshimura et al.
patent: 4100566 (1978-07-01), Okikawa et al.
patent: 4204248 (1980-05-01), Proffit et al.
patent: 4387413 (1983-07-01), Griffis
patent: 4636580 (1987-01-01), Neidig et al.
patent: 4951124 (1990-08-01), Sawaya

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