Microwave device package

Details Microwave device package Microwave device package

1988-11-25

1990-06-12

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 174 525, 333247, H01L 2316

Patent

active

049337459

ABSTRACT:
A package is provided for a pair of microwave semiconductor devices, such package comprising upper and lower mating covers, each one of such covers having bonded thereto a corresponding one of the pair of microwave semiconductor devices. With such arrangement, after the devices are bonded to the cover to form a component of the package, the effective impedance of the thus formed component is electrically characterized, or measured. Having characterized a large quantity of such components, the components are then sorted into bins with components having substantially matched characteristics being placed in a common one of the bins. Pairs of such components in a common bin are used as the upper and lower cover for the package. Thus, assembly time is significantly reduced since additional matching compensation techniques are not required.

REFERENCES:
patent: 3886505 (1975-05-01), Jacobson
patent: 4211986 (1980-07-01), Tajima
patent: 4575701 (1986-03-01), Greed

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