Heat sink and interconnection arrangement for series connected p

Details Heat sink and interconnection arrangement for series connected p Heat sink and interconnection arrangement for series connected p

1984-10-01

1987-06-02

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 16HS, 363141, 363144, H05K 720

Patent

active

046708170

ABSTRACT:
A metal base plate has two spaced thermally conductive ceramic bars fixed to one surface. The outwardly facing surface of the bars has spaced conductive pads. A plurality of diodes which are of alternating opposite polarity have axially extending leads extending between the bars in spaced parallel relationship with respect to one another, and are soldered to the conductive pads on the bars to define a series connection of the diodes. The suspended diodes and their leads are then encapsulated in a body of polymerizable material containing thermally conductive electrically insulative particles suspended therein such that the particles occupy more than about 75% of the encapsulating mass.

REFERENCES:
patent: 3435891 (1969-04-01), Parrish
patent: 4015184 (1977-03-01), Cooperman
patent: 4458305 (1984-07-01), Buckle et al.
patent: 4506320 (1985-03-01), Koroncai et al.
Arnold et al, "Module with Internal Elements for Reducing Thermal Resistance", IBM Technical Disclosure Bulletin, vol. 21, No. 4, 9/78, pp. 1473-1474.

Affiliated with

Also associated with

Rating

Heat sink and interconnection arrangement for series connected p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink and interconnection arrangement for series connected p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink and interconnection arrangement for series connected p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-617409