Heat exchange – With retainer for removable article – Including liquid heat exchange medium
Patent
1979-06-11
1980-10-07
Richter, Sheldon
Heat exchange
With retainer for removable article
Including liquid heat exchange medium
165 80C, 165185, 357 81, 361386, H01L 2340
Patent
active
042262810
ABSTRACT:
A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring means is located between the housing and the pin to provide a predetermined spring loading of the pin-piston against the exposed surface of the chip. A header is located at the outer end of the pin-piston in contact with the exposed surface of the chip thereby, providing multiple pin-piston contact with the exposed surface of the chip regardless of the chip tilt which improves the heat transfer. The heat transfer can be controlled by including or removing pin-pistons in accordance with the heat transfer desired.
REFERENCES:
patent: 3128419 (1964-04-01), Waldkotter et al.
patent: 3387191 (1968-06-01), Fishman et al.
patent: 3390717 (1968-07-01), Townsend
patent: 3993123 (1976-11-01), Chu et al.
patent: 4153107 (1979-05-01), Antonett et al.
patent: 4156458 (1979-05-01), Chu et al.
Conduction Cooling, Chu, IBM Tech. Disc. Bull., vol. 21, No. 2, Jul. 1978, pp. 752-753.
Heat Sink, Bryden, IBM Tech. Disc. Bull., vol. 11, No. 10, Mar. 1969, p. 1323.
Conduction Cooling Module with a Variable Resistance Thermal Coupler, IBM Tech. Disc. Bull., vol. 21, No. 6, Nov. 1978, p. 2434, Gupta et al.
Chip Cooling, Krumm, IBM Tech. Disc. Bull., vol. 20, No. 7, Dec. 1977, pp. 2728-2729.
International Business Machines - Corporation
Richter Sheldon
Sweeney, Jr. Harold H.
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