Electrically conductive thin epoxy bond

Details Electrically conductive thin epoxy bond Electrically conductive thin epoxy bond

1985-07-22

1987-06-02

Schofer, Joseph L.

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Web or sheet containing structurally defined element or...

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428414, 428415, 428416, B32B 2738

Patent

active

046703390

ABSTRACT:
The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.

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