Solid-state image sensor assembly with image sensor element chip

Details Solid-state image sensor assembly with image sensor element chip Solid-state image sensor assembly with image sensor element chip

1996-02-21

1998-05-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361783, 174 524, 257432, 257433, 396542, H05K 702, H05K 103, H01L 310203, H01L 310232

Patent

active

057484481

ABSTRACT:
The solid-state image sensor disclosed includes a package accommodating an image sensor element chip, and a plurality of wiring patterns carried by a flexible printed wiring circuit board. Each of the wiring patterns is a continuous seamless pattern and has electrode portions for connection with the element chip and for connection with circuit components, and a wiring portion disposed between those electrode portions. The flexible printed wiring circuit board is capable of being bent, extends through and out from the package, and is unitary with the package. The arrangement enables the compact accommodation of the element chip together with other components and the reduction in the number of steps for the fabrication.

REFERENCES:
patent: 4296457 (1981-10-01), Hahlganss
patent: 5220198 (1993-06-01), Tsuji
patent: 5253010 (1993-10-01), Oku et al.

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