Process for bonding copper or copper-chromium alloy to ceramics,

Details Process for bonding copper or copper-chromium alloy to ceramics, Process for bonding copper or copper-chromium alloy to ceramics,

1983-02-08

1985-02-19

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156286, 156305, 1563066, 156325, 228124, 4271262, 4271263, 427404, 428432, 428472, 428621, 428630, 428699, B29C 1700

Patent

active

045003831

ABSTRACT:
A process for bonding a copper or copper-chromium alloy body and a ceramic body of components of an electrical or electronic device to each other includes a step of directly sandwiching a layer of chromium oxide between the ceramic and copper or copper-chromium bodies, a step of heating a temporary assembly of the ceramic and copper or copper-chromium alloy bodies and the layer of chromium oxide, under an atmosphere which can oxidize chromium without oxidizing copper, at a temperature of at least 900.degree. C. but below the melting point of copper or the alloy, and then a step of slowly cooling the resulting bonded assembly. In particular, in a process for bonding the alloy body to the ceramic body, the chromium oxide sandwiching step is performed concurrently with the temporary assembly heating step. The bonding process can produce a hermetic envelope, particularly a vacuum envelope of a vacuum interrupter. The process for bonding the copper or alloy body to the ceramic body of this invention is more advantageous than bonding processes employing the so-called Telefunken method, in terms of cost and steps.

REFERENCES:
patent: 2130879 (1938-09-01), Dobke
patent: 3296017 (1967-01-01), Rubin
patent: 3360349 (1967-12-01), Adomines
patent: 3390969 (1968-07-01), Sullivan et al.
patent: 3676292 (1972-07-01), Pryor et al.
patent: 4364995 (1982-12-01), Crawford et al.

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