Chemistry: electrical and wave energy – Processes and products
Patent
1989-11-20
1990-06-12
Kaplan, G. L.
Chemistry: electrical and wave energy
Processes and products
204 451, 204434, 2041531, G01N 2700, G01N 2728
Patent
active
049325183
ABSTRACT:
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
REFERENCES:
patent: 3121053 (1964-02-01), Hull et al.
patent: 3128371 (1964-04-01), Spaulding et al.
patent: 4102770 (1978-07-01), Moriarty et al.
patent: 4487681 (1984-12-01), Cordes
D. R. Turner, Plating and Surface Finishing, pp. 32-35, Jul. 1979.
Bernards Roger F.
Fisher Gordon
Sonnenberg Wade
Goldberg Robert L.
Kaplan G. L.
Shipley Company Inc.
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