Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1979-04-25
1980-12-16
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156668, 427304, 427305, 427306, 427307, 430319, C23C 302, H01B 514
Patent
active
042398134
ABSTRACT:
Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.
REFERENCES:
patent: 3562038 (1971-02-01), Shipley et al.
patent: 3619285 (1971-11-01), Feldstein
patent: 4054479 (1977-10-01), Peiffer
patent: 4086128 (1978-04-01), Sugio et al.
patent: 4112139 (1978-09-01), Shirk et al.
patent: 4151313 (1979-04-01), Wajima et al.
Feldstein, "Selective Electroless Plating Techniques: A Survey", Plating, Aug., 1970.
Tabei, et al., "Method for Forming a Printed Circuit by Photolysis of Silver Salt of Organic Acid", J. Electrochem. Soc., vol. 121, No. 1, pp. 67-69 (1974).
Kawamoto Mineo
Matsuda Yoichi
Morishita Hirosada
Murakami Kanji
Wajima Motoyo
Hitachi , Ltd.
Smith John D.
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