Thin semiconductor card

Details Thin semiconductor card Thin semiconductor card

1987-03-17

1988-08-16

James, Andrew J.

357 74, 357 68, H01L 2318, H01L 2330, H01L 2304, H01L 2310

Patent

active

047648031

ABSTRACT:
The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.

REFERENCES:
patent: 4463971 (1984-08-01), Hoppe et al.
patent: 4639585 (1987-01-01), Haghiri-Tehrani et al.

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