Method of fabricating high density electronic circuits having ve

Details Method of fabricating high density electronic circuits having ve Method of fabricating high density electronic circuits having ve

1981-04-01

1983-11-29

Kucia, R. R.

Metal working

Method of mechanical manufacture

Electrical device making

29849, 174 685, H05K 346

Patent

active

044173938

ABSTRACT:
Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.

REFERENCES:
patent: B437450 (1975-01-01), Older et al.
patent: 3040213 (1962-06-01), Byer et al.
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3445921 (1969-05-01), Leenhouts
patent: 3770529 (1973-11-01), Anderson
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3837074 (1974-09-01), Griff
patent: 3846166 (1974-11-01), Saiki
patent: 4096626 (1978-06-01), Olsen et al.
"Laser Drilling of Vias in Dielectric for High Density Multilayer Thick Film Circuits", Cocca and Dakesian, Solid State Technology, Sep. 1978, pp. 62-66.

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